Printed circuit boards are the heart of modern technology and the core of all electronic devices. Conductor tracks produced using etching technology ensure the electrical connection between the individual components. Depending on the intended use, fundamentally different requirements are placed on the boards, so that their individual design can be completely different. In order to do justice to this variety in terms of quality, we have countless options available for you.
Simple circuit boards include single-sided circuit boards and double-sided circuit boards. Single-sided circuit boards have copper structures on only one side. Double-sided circuit boards have a connection to the other side via through-hole plating, which means there is twice the surface area for circuits.
Multilayers have additional inner layers that are connected to one another via plated through holes, making extensive and dense switching structures possible. The possible combinations of materials also provide almost endless design possibilities.
In contrast to rigid (rigid-flex) boards, semi-flexible circuit boards are flexible at specific points. It should be noted that, in contrast to flexible circuit boards, bending cycles and bending angles are more restricted. This process is particularly suitable for double-sided circuit boards and multilayers.
We produce our circuit boards exclusively in Krefeld on the Lower Rhine! We place great value on quality and reliability. With our express circuit board service, we guarantee fast delivery to meet your requirements.
Our environment is important to us. We use the materials used in production with the utmost care and strive every day to keep consumption as low as possible. Wherever possible, we only use recyclable materials.
RoHS compliant (lead-free), DIN EN ISO 9001 and UL® certified
Standard delivery time from 6 working days
Express service for all quantities from 3 working days
1-sided circuit boards up to 24-layer multilayer
Our experts are available Monday to Friday from 8:00 a.m. to 18:00 p.m.
Exclusively German production and administration. Your data is safe with us.
We attach great importance to controlled production and good service. Ultimately, we want our circuit boards to be a reliable foundation for your electronic assemblies in all areas of application. In our picture gallery you can see our modern technology and dedicated employees in action.
The current developments surrounding Nexperia demonstrate with full force how vulnerable supply chains still are – not only for high-end chips, but also for “inconspicuous” standard components that are found in every vehicle and every machine.
Future under one name – MicroCirtec becomes part of PRECOPLAT. Printed circuit board expertise from Krefeld bundled.
As a company rooted in Krefeld, PRECOPLAT is committed not only to high-quality printed circuit boards, but also to sustainable and social interaction. The Emmaus Community Krefeld e.V. recently visited us and accepted a donation of decommissioned office and IT equipment. Instead of being stored unused or disposed of, these devices are now finding new uses in a social context.
Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).
OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.
The shelf life is limited to 6 months.
Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.
A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).
Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.
The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.
Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.
This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.
ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.
The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.
The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.
The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.
The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.
HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.
