Why circuit boards “Made in Germany”?

Customs duties, unstable supply chains and uncertainties - For printed circuit boards, rely on PRECOPLAT and "Made in Germany"

Given the increasing geopolitical uncertainties these days, companies in Europe should be aware that globally structured supply chains could soon become dysfunctional due to completely changed market situations and disruption. Crises such as the coronavirus pandemic have painfully demonstrated that even supposedly long-term cost advantages from low-cost sourcing from Asia can ultimately lead to higher total cost of ownership (TCO) due to longer-term procurement problems. Therefore, the "Made in Germany" concept is becoming increasingly important and essential for companies that value quality.

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In this global view, the advantage of local manufacturers is becoming increasingly attractive. Especially in industries where precise, complex and reliable components such as printed circuit boards (PCB) are essential, European manufacturers such as PRECOPLAT decisive advantages:

This quality and reliability are in line with the image of products that are “Made in Germany” and underline the advantages of local production.

Reliable quality without compromise

One of the biggest challenges is the quality of imported PCBs. Since you are often dealing with suppliers from different regions, there can be significant differences in manufacturing standards and quality requirements. This can lead to the assemblies associated with the PCBs being compromised by faulty components - which can lead to production downtime and increased warranty risks.

PRECOPLAT guarantees consistently high quality and reliability through strictly monitored processes at the sole production site in Germany.

"Our customers benefit from a location advantage that not only impresses with quality and reliability, but also with sustainability. With short delivery routes and efficient production, we are actively contributing to climate protection," explains Andreas Brüggen, Managing director of PRECOPLAT GmbH. "Our flexibility and experience enable us to implement individual customer requirements quickly and reliably."

communication without hurdles

Instead of laborious communication across time zones and language barriers, customers benefit from a direct contact person on site. This means that individual requirements are immediately understood and implemented precisely. The website also provides a Live chat with direct contacts from the sales department. In addition, PRECOPLAT numerous other uncomplicated communication channels to process your requests quickly and reliably.1

Calculable costs without customs duties

Don't be caught unprepared by new tariffs - be prepared! In times when trade conflicts, uncertain transport routes and exchange rate fluctuations as well as tariffs imposed by the US administration and on imports from Asia are causing turbulence, it makes more sense to rely on a circuit board that is completely manufactured in Germany.

Build local, reliable supply chains with trustworthy partners in a timely manner. Rely on PRECOPLAT and get your PCBs always on time and without customs problems. Production in Germany ensures transparent and predictable prices.

protection of intellectual property

When importing PCB's There is always a risk of infringement of intellectual property rights. PRECOPLAT your intellectual property is always safe. There are no risks from counterfeit or cloned circuit boards, only credible, certified products directly from our own production in Germany.

On-time deliveries – 365 days a year

In events like the Chinese New Year celebration Many companies in China are on holiday, which results in delivery delays. PRECOPLAT There are no such bottlenecks. Our PCB production in Krefeld continues to run reliably, so that customers receive fast and predictable deliveries at all times – and that year-round. With printed circuit boards "Made in Germany" rely on a reliable supply chain without unexpected risks.

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.