The high-density printed circuit boards (HDI) Besides the layout, process control is particularly crucial. This includes automated optical inspection (AOI) with the finest resolution, final electrical testing with clearly defined limits, and a layer stack-up that maintains specified impedances even under real-world conditions. PRECOPLAT, a manufacturer of bare printed circuit boards "Made in Germany," relies precisely on this interplay – as an integral part of production, from the initial inner layer layout to final inspection.
Katharina VÖLKERThe management emphasizes the importance of AOI as an integral component of quality assurance: “AOI is not implemented as an isolated solution, but as a continuous inspection module across all production stages. With a minimum structure of 25 µm, we can reproducibly capture dense geometries in series production – inline, traceable, and reliably documented.” The AOI platform used is from the CIMS Galaxy 25-µThe -family is suitable for line/space testing up to 25 µm.Microlight™ Gen II It ensures homogeneous illumination, while adaptable algorithms stabilize detection performance with a low false-call rate. Options such as [list of options] are available for specific tasks. 2D metrology, final visual inspection as well as Laser borehole inspection ready.
Technically, AOI follows a standardized process: The image reference is... IPC-A-600Acceptance is based on the ordered class (2/3). PRECOPLAT thus meets the expectations of developers who explicitly request optical inspection – and combines visual testing with the usual standards and verifications of series production.
At the end of the production process, a electrical final test This electrical final test checks for open circuits and short circuits against a netlist generated from customer data. The test procedure depends on the batch size and design. Test adapter (parallel test) or Flying probe (finger tester)Open tests are performed when the network resistance exceeds 10 Ω, while short tests are performed when the resistance between independent networks is below 10 MΩ. Faulty or inconclusive circuit boards are automatically separated, logged, and fully retested after rework. This is done in accordance with the guidelines. Production and testing data stored for a period of at least 10 years. at Precoplat The documentation is stored. It is supplemented by X-ray measurements, such as layer registration and coating thickness measurement. "AOI detects – the E-test confirms; both together minimize field results," he emphasizes. Andreas BRÜGGEN, Managing Director.
For HDI designs, this is Via Management of crucial importance. That Via-in-Pad with Microfilling Enables short transitions in BGA/CSP zones. Blind vias are placed directly in the pad, copper-filled, and planarizedOne possible alternative is the Resin pluggingThis method is particularly suitable for sealing through holes with a diameter of 0,10 mm to 2,00 mm. A key advantage of this method is the complete planarity of the pads. For blind vias and micro-vias, the aspect ratio is limited to a maximum of 1:1 (drill depth ÷ diameter). The relevant parameters are specified in the [document/section/etc.]. "Technical Delivery Conditions (TLB), Recommendations and Design Rules for Technical Delivery Conditions (TLB)"Printed circuit boards" from PRECOPLAT transparently stored and are in Design Rule Check Project-specific insurance coverage.
The benefit arises from the System networkAOI provides pixel-accurate, statistically usable defect images; the E-test confirms electrical integrity; Impedance engineering and HDI manufacturing ensure functionality within the target system. By combining individual test steps into a single step... Closed-loop Development and manufacturing are equally catered for – from prototypes to large-scale production. Cycle time, verification, and reproducibility remain unchanged.
