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Our technologies

PCBs are carriers of electronic and electromechanical components. Electricity is transported efficiently and without interruption from component to component via conductor tracks and holes, either in the form of electrical energy or as an information signal.

The use of electronics in a wide variety of areas and the associated requirements as well as the progressive miniaturization of electronics require increasingly sophisticated manufacturing technologies. With the technologies listed here, we cover Precoplat, meet these demanding requirements worldwide.

Single- and double-sided circuit boards

Single-sided circuit boards are used for simple circuits and are the "mother of all circuit boards". The conductor tracks are applied to the copper using a phototechnical process and then etched. These conductor tracks are located on one side of the board and the holes are usually used to attach the components.

Double-sided PCBs have conductive connections on both sides. The tracks are connected by holes that are plated through so that current can be transferred to the other side of the board. There are different types of plated through holes, including thermally conductive, metallized holes (thermovias), vias and active holes with a larger diameter (>0,60 mm).
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prototype to (large-scale) series

We produce all batch sizes, from prototypes to medium-sized series and large series. Unlike many other manufacturers, we completely avoid supplementing our product portfolio with commercial goods (especially from the Far East). 100% of our products - from work preparation to delivery - are manufactured in our production facility in Krefeld. We are convinced that this is the only way we can guarantee the highest level of reliability in terms of service, quality and delivery times in the long term!

You determine the series size, we implement the desired delivery time.

We can produce series of up to 25 m² per order within 3 working days. Small and medium series of 2,5 m² to 25 m² and large series of 25 m² to 60 m² can be produced within 10-15 days or 15-20 working days. Even faster in express service.
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HDI circuit boards

Our HDI circuit boards, or high-density interconnect circuit boards, are masterpieces of technology. They make it possible to accommodate a large number of connections and components in compact electronic devices. The secret behind HDI is extremely fine conductor tracks and the use of micro vias.

Thanks to our HDI circuit boards, electronic devices can be made more compact and more powerful. HDI circuit boards are used in particular in high-tech products such as smartphones and laptops. We recommend using our ENIG or chemically tinned surfaces, as they are exceptionally flat and optimally support the performance of our HDI circuit boards.
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surface finishing

In our Krefeld plant we produce printed circuit boards with the most modern surface finishes.

We can currently produce the following finishes for you:
  • hot air tinning lead-free (HAL)i
  • chemical nickel-gold
    (NiAu or ENIG)i
  • ENEPIGi
  • Chemical tin (Chem.Sn)i
  • Chemical Silver (Chem.Ag)i
  • Organic Tarnish Protection (OSP)
    (Organic Surface Protection)i
  • Galvanic nickel-gold (plug gold plating)i
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Multilayer

Multilayer printed circuit boards or multilayer circuits essentially consist of three different materials: copper foil, prepreg and copper-clad thin laminate. Depending on the layer structure, there are countless possible combinations. We offer multilayers with up to 24 layers. We offer a variety of different prepregs and cores that you can choose for your individual material structure.

In our multilayer press center, the different layers are pressed together under high pressure and temperatures of up to 200°C, so that separation or delamination of the materials is extremely unlikely, even under difficult electrical loads. The layers are then connected to one another via through-holes between the outer layers (vias), from an outer layer to an inner layer (blind vias) or between the inner layers (buried vias).

Notes on material structure

Base

The CAF (Conductive Anodic Filament) resistant FR4 base material is permanently in our stock.

  • in thicknesses from 0,5 to 3,2 mm
  • tracking index (CTI) values ​​up to 600 volts
  • TG value up to 170 degrees Celsius

Available directly:
  • FR4 TG 135°-140°; CTI 175-249 (standard)
  • FR4 TG 150°
  • FR4 TG 170°
  • FR4 CTI 400
  • FR4 CTI 500
  • FR4 CTI 600
  • CEM1
  • CEM3

In addition, we can procure additional base materials of various thicknesses upon request.
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semi-flexible circuit boards

Circuit boards that partially have both flexible and rigid material structures are referred to as semi-flexible circuit boards. This intelligent combination of flexibility and stability offers the ideal solution when only occasional bending cycles are required. Semi-flexible circuit boards not only score points for their adaptability and cost-effectiveness compared to the more flexible rigid-flex circuit boards, but they are also extremely versatile.

During production, the flexible areas of the circuit board are milled down to a precisely defined residual thickness so that they meet the required specifications.
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Download Center

All technical parameters, multilayer layer structures, our certificates, supplier self-assessment and more for download

Technical Details (FAQ)

  • Final copper thickness 18 µ to 140 µ
  • Final copper thickness 20 -25 µ in the vias (standard)
  • Final copper thickness > 25 µ in the vias (according to IPC A600 Class 3)

Layout data:

  • Extended Gerber 274x (standard)
  • Eagle (Standard)
  • Gerber 274
  • ODB++

Drilling and milling data:

  • Excellon (Standard)
  • Drillfile in Sieb & Meyer Format 3000
We manufacture printed circuit boards according to IPC-A-600 Class 2 or Class 3.
In addition, we can also produce according to the following standards:
  • PERFAG 1-3
  • IPC-SM-840
  • IPC-R-700
  • IPC-A-600
  • IPC-6012
  • IPC-2221

We are certified according to DIN EN ISO 9001 and UL©.

Production parameters, production conditions and raw materials are evaluated and recorded using calibrated measuring instruments.

test procedure
The quality of the circuit boards is continuously checked during production in the following ways:

  • non-destructive testing
    For automatic and optical tests, we adhere to the IPC-A 600, Class 2 standard. Specific test procedures can be adapted to other specifications at any time if required.
  • destructive testing
    • micrograph creation (determination of the galvanic copper deposition and thickness of the surface protective layer),
    • adhesion test,
    • Pressure Cooker Test (multilayers are regularly subjected to thermal shock tests).
  • documentation of the parameters
    Automatic recording and storage of the following parameters for at least 10 years:
    • production parameters,
    • quality-related results,
    • Time recording, including the respective employees.
  • Electrical testing
    During the final electrical test, circuit boards are checked for interruptions and short circuits. (> 10 Ohm: interruption; < 10 MegOhm: short circuit)
    We use the following test systems:
    • test adapter/parallel tester,
    • Finger tester (flying probe).
  • X ray
    X-ray fluorescence spectrometry for layer thickness measurement and material analysis (metals).
  • green (default)
  • blue
  • black
  • red
  • white
  • TOP/BOTTOM can be painted differently


Solder resists, also called solder masks, are primarily used to protect copper structures from oxidation and damage to the surface. The classic color of the circuit board is green. The color is achieved by applying the solder resists, which we offer in blue, black, red and white in addition to the green color.


The solder mask coating is realized using the photo printing process: The circuit board surface is coated with a special varnish that can be polymerized using UV light and then exposed phototechnically. The non-polymerized components used in the exposure process remain water-soluble and are developed with sharp contours, even in the micrometer range. In order to achieve the required electro-physical properties of the varnish, a final thermal curing then takes place.


We only use solder resists based on epoxy resin, as these additionally improve the tracking resistance on the surface of the circuit boards.

  • cracks
  • Shaping
  • deep milling
  • milling and scoring combination
  • chamfers
  • edge metallization
  • countersunk holes
  • deep drilling
 

Smallest final drilling diameter: 0,1 mm


We drill, mill and score your circuit boards according to your specifications and wishes. The type of mechanical processing depends on your individual specifications.
In our drilling and milling center we work with modern, fully automatic CNC drilling and milling machines.


cracks

The technique with the least material waste for the mechanical finishing of rectangular boards or panels and straight outer contours is the so-called notch milling or scoring.

The circuit boards are positioned between a scoring cutter above and below the circuit board. A groove of a defined depth is milled into the material using CNC control, leaving a residual web or a predetermined breaking point. The circuit board can be separated at this groove either immediately or after further processing steps, such as the assembly process, manually or with a panel separator.

Advantages: Since no space is required for a milling cutter, the circuit boards can be arranged at “0-distance”, making notch milling a cost-effective alternative for larger order volumes.


Shaping

As an alternative to scoring, we offer contour milling. The advantage over scoring is that the outer contours can be machined in the most specific shapes and cutouts, such as round, oval, wave-shaped, zigzag, etc. We also offer to cut through your circuit board not completely, but only to a set depth.

When milling, please note:

  • If the delivery is to be made in a milled panel, a distance of 2,0 mm within the panel is usually sufficient to be able to place milling bars between the individual boards.
  • If the delivery is not to be made in panels, a distance of at least 8,0 mm from board to board must be taken into account in order to be able to ultimately separate the circuit boards.



deep milling

If required, we can also carry out deep milling. The depth of the milling depends on your specific requirements and can be customized. This enables the creation of circuit boards with complex structural requirements and facilitates the integration of various components.


milling and scoring combination

In some cases it makes sense to combine both milling and scoring to achieve the best compromise between cost and material loss. Our CNC machines are able to implement these combinations precisely.


chamfers

We also offer bevels for special applications where rounded edges are required. The bevels can be designed according to individual specifications.


edge metallization

To prepare the PCBs for specific applications, we can apply special edge metallizations (e.g. castellated holes). This is particularly useful when improved electrical conductivity or shielding is required.


countersinking and deep drilling

Depending on your needs, we can carry out countersinking or deep drilling. The specifications for this can be determined individually.

  • via plugging
  • via filling
  • micro-filling
    (resin filling)
  • label printing (single-sided, double-sided)
  • Eco Inkjet in Express Service
  • Carbon
  • peel-off varnish
  • Kapton tape
  • flexible paint

Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.