PRECOPLAT on the way to CO2 neutral production

By installing a rooftop photovoltaic system, PRECOPLAT is securing its competitiveness in the power-intensive production of printed circuit boards in Krefeld

PRECOPLAT GmbH continues to invest in a sustainable future and has now inaugurated a hugely enlarged photovoltaic system on its roof. By using over 1.200 modules and a total net area of ​​around 3.000 square meters, the German circuit board manufacturer has achieved a great deal of independence from the German electricity market, which is expensive for electricity-intensive companies by international standards. According to managing director Andreas BRÜGGEN, PRECOPLAT wants to provide "a sustainable answer" to the international distortion of competition - especially among Eastern European and Asian suppliers who generate price advantages through subsidized coal-fired electricity. "When purchasing our circuit boards, our customers should have the feeling that they have chosen a sustainable future and climate protection," says Andreas BRÜGGEN. "We want to prove that climate protection, quality and good prices are not mutually exclusive. With the total generator output of the photovoltaic system of 660 kW peak, we can ensure this."

Panoramic image of the first section of the roof photovoltaic system at Precoplat
Panoramic image of the first section of the roof photovoltaic system at Precoplat

The installation of the photovoltaic system is just one part of a comprehensive package of measures for climate protection and sustainability that PRECOPLAT is implementing and driving forward. Among other things, PRECOPLAT promotes environmentally friendly mobility for employees, relies on heat recovery to reduce the use of fossil fuels, installs an energy management system to reduce energy consumption and gradually implements an energy-efficient renovation of the historic administration building from the Wilhelminian era. In addition, the company supports campaigns such as the BUND's Moorland® project to promote climate-positive measures.

The overarching goal is to prove that even energy-intensive small and medium-sized companies can reduce CO2 Neutrality can be achieved. The realization of the large-scale photovoltaic plant alone will produce around 650.000 kWh of renewable energy annually. This corresponds to the average annual electricity consumption of almost 200 German households per year and will help to reduce CO2 company's emissions by up to 316.000 kg of CO2 annually. To put it even more clearly: To compensate for this amount, over 630 trees would have to be planted. "We are proud to be part of the solution for a better world and hope that we can inspire others to use renewable energies," adds Katharina VÖLKER, another member of the management team.

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.