Semi-flexible circuit boards

Printed Circuit boards that have partially flexible as well as rigid structures are termed semi-flexible or half-flexible boards. They generally cost less than so-called starrflex printed circuit boards and are preferred when only a few bendable cycles are required.

In the manufacturing process, the flexible areas are scored to a predetermined, exactly defined residual thickness, so that these correlate with the required and physically possible bendable needs and cycles.

EXECUTION

  • semi-flexibel

BASIS MATERIAL

  • FR4 TG 135°-140° (Standard)
  • FR4 CTI 175-249 (Standard)
  • FR4 TG 150°
  • FR4 CTI 400
  • FR4 CTI 500
  • FR4 CTI 600
  • FR4 halogenfrei
  • FR4 CAF-beständig
  • CEM1
  • CEM3

CIRCUIT BOARD STRENGTH

  • 0,5 mm bis 3,2 mm

SURFACES

  • Heissluftverzinnt bleifrei (HAL bleifrei)
  • Chemisch Nickel-Gold (NiAu oder ENIG)
  • Chemisch Zinn (Chem.Sn)
  • Chemisch Silber (Chem.Ag)
  • Galvanische Hart-/Steckervergoldung
  • OSP (Organic Surface Protection)

FINAL COPPER STRENGTH

  • Endkupferstärke 18 µ bis 140 µ
  • Endkupferstärke in den Durchkontaktierungen ca. 20 µ -25 µ (Standard)
  • Endkupferstärke in den Durchkontaktierungen > 25 µ (nach IPC A600 Klasse 3)

SOLDERMASK

  • grün (Standard)
  • weiß
  • schwarz
  • rot
  • blau

MINIMUM FINAL DRILLING DIAMETER

  • 0,10 mm

MINIMUM STRUCTURE (CONDUCTOR PATH/ISOLATION WIDTH)

  • ≥ 75 µ

CONTOUR PROCESSING

  • Fräsen
  • Ritzen
  • Fasen

ADDITIONAL PRINTS

  • Kennzeichnungsdruck (einseitig, beidseitig)
  • Via-Plugging
  • Carbon
  • Abziehlack
  • Captonband
  • Flexibler Lötstopplack (grün)

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