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PRECOPLAT and MicroCirtec merge

Future under one name – MicroCirtec becomes part of PRECOPLAT. Printed circuit board expertise from Krefeld bundled.
The managing directors of Precoplat Andreas Brüggen (left) and Katharina Völker (right). - Copyright: Lichthalle / Fredda Weiler

PRECOPLAT Präzisions-Leiterplatten-Technik GmbH is strategically realigning its operations: Effective August 1, 2025 , MicroCirtec Micro Circuit Technology GmbH was fully merged into PRECOPLAT GmbH. As a result, MicroCirtec was dissolved as an independent company – all business relationships, rights, and obligations have been transferred entirely to PRECOPLAT.

What at first glance appears to be a purely formal step actually means: more clarity, more efficiency and more performance – for our customers and partners.

The merger is the result of consistent strategic development. PRECOPLAT aims to further integrate consulting, processes, and resources , uniting them under one roof. "By focusing on PRECOPLAT as a strong brand, we are pooling our expertise and will be able to provide our customers with even better and more targeted advice in the future," says Andreas Brüggen , Managing Director of PRECOPLAT. Katharina Völker , also a Managing Director of PRECOPLAT, adds: "For our customers, this step means continuity and reliability. Together with our dedicated team, we want to ensure our high quality standards while remaining flexible enough to respond to new requirements."

For our customers and business partners of MicroCirtec, the merger will not result in any changes in day-to-day business:

  • Existing contracts remain fully valid.
  • From the effective date of the merger, invoices and all business documents will be issued under the new company name PRECOPLAT.
  • MicroCirtec customer numbers will continue under the new company name to ensure consistent documentation.
  • Contact persons, telephone numbers and the business address remain unchanged.
  • In future, email addresses will be @precoplat.de; the old @microcirtec.de-Addresses will be forwarded first.
  • The Online calculator (online shop) is now available at shop.precoplat.de accessible; previous login data remains valid and all order histories have been transferred.
  • The production of the printed circuit boards continues to take place entirely at the same location in Krefeld – with usual quality – Made in Germany.

With the new structure, PRECOPLAT is creating the foundation for greater digital continuity , a clearer external image , and optimized internal processes . This transforms two companies into an even stronger partner – with the same high levels of reliability, precision, customer focus, and quality in every aspect.

We look forward to your inquiry.

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.