Direct Imaging – precise structuring of printed circuit boards

Printed circuit board layouts using ultraviolet LED light. High-precision digital and direct structuring of printed circuit board layouts.
The electronics market has been demanding smaller, lighter and more reliable electronic devices for many years and will continue to do so in the future.

In view of the increasing demand for increasingly complex electronic components with an increasing integration of more and more functions on chips and other electronic components, the requirements in terms of complexity and miniaturization of conductor tracks, pads and other structures on the circuit board are also growing. For conductor track widths and spacings of less than 50my, the contact exposure technology using exposure masks, which is widespread in the circuit board industry, reaches its limits. Direct imaging by laser (LDI), in which a laser guided by a complex mirror system projects the layout images onto the photosensitive layer of the circuit board, was for a while the only and extremely maintenance-intensive technology to meet these miniaturization requirements. PRECOPLAT is now relying on a more cost-effective and resource-saving direct imaging technology based on ultraviolet LED light, the so-called micromirror digital imaging, developed by the German drilling machine and exposure technology specialist Schmoll Maschinen.

Laser unit of the MDI system from Schmoll for structuring printed circuit boards - Author: Schmoll Maschinen GmbH
Laser unit of the MDI system from Schmoll for structuring printed circuit boards

The fully automatic MDI system from Schmoll is characterized by the fact that highly concentrated UV light with a defined wavelength is directed over a microchip equipped with thousands of high-precision micromirrors and the layout is created on the circuit board in a short path with less energy loss than with a laser. Due to the shorter light path and the lower power loss, only LEDs are required as a light source and the interference-prone lasers with a much lower durability can be dispensed with. Thanks to multiple wavelengths, the system can also guarantee a suitable light spectrum for the photosensitive solder mask production. Since the exposure heads can be flexibly aligned in all directions with the mirror systems, it is possible to serve a wide variety of panel formats with little effort and without additional set-up time. As usual, the established use of linear drives and direct position measuring systems ensures reproducible results of the highest precision.

Compared to conventional LDI systems (laser direct imaging), the MDI machines also require significantly less space and have a significantly better overall energy balance. Since the LEDs require less energy to generate the necessary exposure energy, the energy requirements for machine and room cooling are also lower.  

The MDI-TTG (Tandem Table) from Schmoll Maschinen used by PRECOPLAT achieves a theoretical resolution of 15my, but finds its practical limitation in the maximum physical performance of the subsequent wet chemical processes such as etching and electroplating at currently 50my. The first fully automatic devices were commissioned in 2022. The systems offer PRECOPLAT customers maximum flexibility for all areas of application, from prototypes to series production.

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.