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Made in Germany

Our philosophy as a service provider and manufacturer is to offer our customers the best possible quality at the best possible price with the best possible delivery time.

In order to economically produce the highest quality products, “Made in Germany” is the ideal choice for us. Here we bring together all departments under one roof: technical work preparation or CAM department, technical sales and production as well as the shipping department can work hand in hand without detours and with short routes.

This is precisely why we are able to respond so quickly and flexibly to any request or requirement you may have for your orders. And because everything works just as smoothly as we imagine, our complaint rate is actually extremely low.

Because we are based in Germany, your (layout) data is always safe from data theft, product piracy or similar. Because: Confidentiality is very important to us.

We manufacture our circuit boards exclusively in Germany! And we do this out of conviction!

Andreas Brüggen - Managing Director -

Optimal location

Our production site in Krefeld is located in the west of Germany in the state of North Rhine-Westphalia. The city of Krefeld on the Lower Rhine is part of the Rhine-Ruhr metropolitan region and is around 30 km from the state capital Düsseldorf. The transport connections in Germany's largest metropolitan area are optimal in every respect and not only facilitate the smooth delivery of our products, but also mean very good accessibility and easy travel routes for employees, suppliers and customers from every region.

Thanks to our location in Germany, we can communicate with our customers at short notice and maintain a lively flow of information – without time differences or language barriers.

Our own claim to exploit the latest technology in the production process, to maintain an adequate wage and salary structure for our employees in Krefeld and thus to manufacture products of the highest quality at fair prices is, in our opinion, only possible in Germany. And that we are right in this regard has been confirmed since 1977.

Your benefits at a glance

  • Sustainability and Human Rights: Our production relies on sustainable materials and processes to minimize the CO₂ footprint. Recyclable materials, wherever possible, are a matter of course for us. Furthermore, the shorter transport routes reduce CO₂ emissions and all processes are monitored by strict certifications as well as environmental and occupational safety requirements. A clear plus point with regard to the supply chain law.
  • Avoiding customs and import problems: Ordering from us avoids possible customs and import problems that can arise when importing from Asia.
  • Security and privacy: European supply chains are less vulnerable to political and economic uncertainty. Your layout data is safe from data theft and product piracy in Germany.
  • Quality and durability: High-quality materials and precise manufacturing techniques ensure long-lasting and reliable circuit boards. Shorter delivery routes greatly reduce moisture absorption and thus the risk of delamination.
  • Economic Development: With your order you support the local economy and secure jobs in the region.
  • Communication and flexibility: Our customers appreciate and benefit from shorter communication channels and can discuss problems or special requests directly with us in the same language. This allows us to react more flexibly to short-term changes and special requirements, which makes project planning and implementation easier. All data supplied to us is checked for manufacturability using a standard design rule check and customer-specific DFM functions. And if something doesn't fit, we'll get in touch with you immediately.

Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.