Production line for etching and stripping in operation

Thanks to the investments in Germany, PRECOPLAT can now produce the finest structures precisely and reliably “Made in Germany”.

With the commissioning of the ultra-modern InfinityLine etching and stripping center, PRECOPLAT has reached another milestone towards future-proof and modern production. The innovative production line for etching and stripping of inner layers, manufactured by SCHMID, offers numerous advantages and enables PRECOPLAT to produce the finest structures on circuit boards with high process reliability and precision. It achieves a speed of up to 1,0 m/min.

Successful test run of the InfinityLine etching and stripping line. The brand new technology is now in use at PRECOPLAT.
Successful test run of the InfinityLine etching and stripping line. The brand new technology is now in use at PRECOPLAT.

The "Fine Line" etching and stripping center relies on intermittent etching or acid etching in conjunction with precise stripping processes in order to meet the increasing demands for the miniaturization of conductor track structures. By using this advanced technology, PRECOPLAT can deliver the highest quality even when the requirements for the miniaturization of conductor track structures are demanding and thick copper technology is required at the same time. Together with the other new acquisitions of recent years, structures with a theoretical resolution of up to 15my are possible. Layer, step or layer etching is now also possible with deviations of less than 2my.

The production line impresses with its enormous flexibility. Thanks to the possibility of adding another etching and stripping module, the production capacity can be almost doubled. This makes it possible to meet the increasing needs of customers efficiently and flexibly.

Katharina VÖLKER, Managing Director at PRECOPLAT, is enthusiastic about the possibilities of the "Fine Line" etching and stripping center: "The commissioning represents a significant step for our company. It underlines our innovative strength and our commitment to offering our customers tailor-made solutions." Andreas BRÜGGEN, also Managing Director at PRECOPLAT, emphasizes the importance of this investment: "We are proud that we continuously invest in the latest technologies in order to offer our customers the best possible solutions. Acid etching is further proof of our advanced production and our commitment to quality and customer satisfaction."

PRECOPLAT not only values ​​innovation, but also, of course, sustainability and environmental protection. The "Fine Line" etching and stripping center relies on resource-saving operation and minimizing emissions. The process is fully integrated into the circular economy, as the used process media are broken down into their components and either recovered as precious metals or reused as a process medium. Since the process takes place in a completely insulated horizontal system with the latest extraction systems, there is no risk to the health of employees.

With the successful operation of the "Fine Line" etching and stripping center, PRECOPLAT once again underlines its position as a leading provider of printed circuit board solutions. "We are proud to be able to offer our customers innovative technologies, the highest quality and an environmentally conscious approach."

The Bundestag member Otto Fricke (FDP) acknowledged the commissioning during his visit and praised the pioneering steps taken by PRECOPLAT. From left to right: Managing Director Andreas Brüggen, MP Otto Fricke (FDP), Joachim C. Heitmann (FDP)
Member of the German Bundestag Otto Fricke (FDP) and a delegation from the FDP Krefeld visit the production line during commissioning.

In summary, the newly inaugurated production line enables a new dimension in the precision of etching conductor track structures. In addition to the general advantage that "acidic" etching attacks the conductor track flanks more moderately and thus reduces undercutting, the vacuum etching technology enables a more uniform and controlled reduction in the copper layer thickness across the entire circuit board layout. The system's ability to etch intermittently makes layer etching possible. With these advantages, the productivity, productivity and precision of etching are significantly increased.

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.