It's 1 to 12 for the European PCB industry

The managing director Andreas Brüggen of PRECOPLAT with an open letter to the partners and politicians
Managing Director of PRECOPLAT: Andreas BRÜGGEN
Managing Director of PRECOPLAT: Andreas BRÜGGEN

“In addition to the generally disastrous economic situation and the well-known locational disadvantages (energy costs, bureaucratic obstacles, etc.), Chinese competition is increasingly driving our industry in Germany to ruin through dumping prices.

According to data from our industry representative ZVEI, order intake at reporting PCB manufacturers, and at the same time representative companies, has halved by almost 2022/2 compared to the first quarter of 3, thus reaching a new low.

At the same time, we manufacturers have tried to reduce the number of employees only slightly in view of the blatant shortage of skilled workers and in order to preserve our know-how. The resulting cost burden cannot be sustained for much longer, or there will either be mass layoffs or company closures very soon.

In addition to the personal dramas, the economic consequences for Germany and Europe are particularly fatal:

  • Printed circuit boards are an essential part of the electronics industry's value chain. Without the necessary capacities and know-how in printed circuit boards, an independent electronics industry in Germany and Europe is just as unviable as the chip industry, which is much more expensive to subsidize.
  • The importance of the printed circuit board has apparently still not been recognized at both the federal and European levels. However, it has been recognized in the USA, which protects its printed circuit board industry through the "Protecting PCB and Substrate Act". Specifically, 3 billion US dollars were made available for the construction of factories, the development of human resources, R&D, and tax credits of 25% for the purchase of "Made in USA" printed circuit boards.

If the EU and Germany want to preserve their technological independence in the face of current geopolitical changes, the printed circuit board industry must not be forgotten under any circumstances. We therefore appeal to our partners and politicians to use their influence at the relevant national and European levels to draw attention to this problem before it is too late."

At the same time, BRÜGGEN also appeals to customers and purchasers of printed circuit boards: "Anyone who orders everything from Asia must be aware that in the long term they are destroying the European supply industry and are becoming dependent. German and European companies must also act responsibly themselves and not just demand that others find a solution."

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.