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Download Center

So that you can plan correctly from the start, we have compiled the necessary key figures, technical parameters and much more for you in the Download Center. We are proud of our quality products. To ensure your PCBs However, in order to be able to produce the product exactly as we and you as the customer imagine it, there are a number of technical requirements that must be observed. Compliance with our design guidelines is, for example, crucial for the structure, behavior under load and ultimately the correct functioning of the circuit boards.

printed circuit boards / structures

Multilayer
layer structure
Standard

layer structure examples

Technical Delivery Conditions (TLB)

Technical parameters,
Recommendations and design rules for printed circuit boards, surfaces, storage, multilayer stackup, and much more.

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Multilayer
layer structure
Special

layer structure examples

Certificates

ISO 9001: 2015

Precoplat

ISO 9001: 2015

PCB Printed circuit boards GmbH

UL Approval ZPMV2 US

Worldwide

UL Approval ZPMV8

Canada

Declarations of Conformity, Directives and Legal Documents

General Terms and Conditions of Sale and Delivery (GTC)

The terms and conditions (“General Terms and Conditions of Sale and Delivery”/GTC) apply to all business transactions with the purchaser or other clients and the supplier.

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Supplier self-assessment

Precoplat Präzisions-Druckerplatten-Technik GmbH

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REACH Declaration (EC)
No. 1907/2006

We guarantee that at present all products we supply do not contain any substances on the current candidate list according to Article 59 of Regulation (EC) No. 1907/2006 (REACH) in excess of 0,1% by weight.

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Regulation (EU) 2019/1021
POP Declaration

The Regulation (as part of the REACH Regulation) on persistent organic pollutants aims to restrict the use and release of certain persistent organic pollutants.

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Product Carbon Footprint (PCF)

The Product Carbon Footprint (PCF) focuses on the global warming potential (GWP) and is considered a key indicator of the threat to natural resources and people's livelihoods.

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Dodd Frank Acts § 1502

Declaration on the renunciation of conflict minerals such as tin, tantalum, tungsten and gold from the Democratic Republic of Congo and neighboring countries.

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RoHS declaration of conformity,
2011/65/EU (RoHS 2) and 2015/863/EU

The RoHS Directive has been in force since July 1, 2006 for newly marketed electrical and electronic equipment and is one of the CE directives. It can be verified via the CE mark on the product.

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UKCA conformity

UK Conformity with the current RoHs Directive for EEE (electrical and electronic equipment) of Great Britain and Northern Ireland as amended in 2012.

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Supplier declaration on per- and polyfluoroalkyl substances (PFAS)

Per- and polyfluoroalkyl substances (PFAS) are to be strictly regulated by law in the EU and worldwide because of their particularly persistent and sometimes toxic properties.

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PBT ban according to
TSCA Section 6(h)

Toxic Substances Control Act is a U.S. law aimed at protecting human health and the environment from hazardous chemicals. Section 6(h) focuses specifically on regulating PBT chemicals.

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.