Enhanced skills for the defense sector

When defense and security are discussed, it's no longer just about steel, but about reliable electronics that function under all conditions. Printed circuit boards "Made in Krefeld" for safety-critical applications.

Andreas BRÜGGEN: “We deliver precisely this foundation: robust, cleanly manufactured, and traceable down to the last stack of materials. No marketing fluff, but honest technology you can rely on.”

Managing directors Katharina Völker and Andreas Brüggen have Precoplat prepared for defense applications

Precoplat, a manufacturer of high-precision PCBs "Made in Germany", expands its field of activity and increasingly opens up applications in Defense sector. In doing so, the company is responding to the increasing demand for reliable, safety-relevant electronic components and at the same time strengthening its role as a reliable partner within European supply chains.

Production in Krefeld is currently being specifically tailored to the requirements of Defense, Second-source and dual-use projects aligned. This includes extended material approvals, seamless process monitoring and Testing procedure according to IPC-6012 and IPC-A-600 Class 3“We are already working on several projects with security implications,” he explains. Katharina VÖLKER, Managing Director at Precoplat"Our goal remains the same as always: Maximum precision, predictable delivery capability and full control – from data verification to final acceptance."

The decision to also open up to the defense sector was carefully considered and follows a clear strategic line: Long-term stability, technological sovereignty and regional value creation. Precoplat sees this as a contribution to Europe's resilience and the strengthening of critical infrastructures. At the same time, the company commits to a responsible and legally compliant handling of data and security-relevant applications in accordance with the regulations of the Federal Republic of Germany and the European Union.

“Ultimately, it’s about reliability – and that’s exactly what we’ve been delivering for years,” Brüggen sums it up. “We see this as the logical next step: If our technology has proven itself in the civilian sector with the highest demands for years, then it will also work where it really matters.”

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.