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Year in review 2025 and outlook 2026

Annual Review 2025: Bundling and Security of Supply - Outlook 2026: New Technical Delivery Conditions (TLB), Recommendations and Design Rules for Printed Circuit Boards

2025 was (once again) characterized by uncertain supply chains, geopolitical tensions and increasing sustainability requirements for the electronics and printed circuit board industry.
We used this environment to Precoplat to be structurally even better positioned.

Merger of MicroCirtec Micro Circuit Technology GmbH into the Precoplat Präzisions-Druckerplatten-Technik GmbH We have consolidated our printed circuit board expertise in Krefeld under one name.

The developments around Nexperi have once again clearly demonstrated how dependent many value chains are on global framework conditions. Our central message in this contextStable electronics production requires more than just one supplier. A second source of supply in Europe, specifically Germany, actively contributes to security of supply and predictability. With printed circuit boards "Made in Germany," we see ourselves as a reliable component in your supply chain.

For us, responsibility doesn't end at the factory gate. In 2025, we will, among other things, Discarded office and IT equipment handed over to the Emmaus Community Krefeld e. V., where they are reused in social projects. Technology that would otherwise have been disposed of is thus given a second life. At the same time, we continue to work on resource-efficient production, including with our rooftop photovoltaic system and technical recommendations regarding climate change-related requirements for printed circuit boards, such as storage and long-term stability. Furthermore, we were able to realize significant energy-saving potential through new production technologies in the photolithographic exposure of solder masks using BEAM technology.

Outlook 2026

New TLB, Recommendations & Design Rules

At the beginning of 2026, we will place a clear focus on transparency and traceability in specifications and layouts: In January 2026, we will publish revised Technical Delivery Conditions (TLB) as well as updated Recommendations and Design Rules for Printed Circuit Boards . publish

The goals of our revision:

  • Clearly structured specifications for standard and special technologies
  • complete overview of our service catalog
  • Fewer queries in quotation, data verification and approval processes
  • a transparent basis for quality requirements and testing.

The new documents will be available as usual on our website in the section Design Rules / TLB Available for download. We will provide you with further details separately at the beginning of 2026.

We wish you and your family a peaceful holiday season and a successful start to the new year 2026.

Precoplat Präzisions-Druckerplatten-Technik GmbH
Katharina Völker, Andreas Brüggen and Hildegard Völker

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.