Nexperia Crisis: Nothing learned from Corona – now secure the supply chain

The current developments surrounding Nexperia demonstrate with full force how vulnerable supply chains still are – not only for high-end chips, but also for “inconspicuous” standard components that are found in every vehicle and every machine.

After the Netherlands took control of the Chinese-owned Dutch chip manufacturer for security reasons, and China banned the export of certain Nexperia parts, the automotive industry is warning of production stoppages. According to reports, manufacturers are even preparing for short-time work; at the same time, it is said that Nexperia cannot reliably guarantee deliveries at this time. It is precisely this complex situation—governance interventions, export bans, months of requalification—that is leading to the acute vulnerability we already experienced during the pandemic. Haven't we learned anything from the coronavirus pandemic? Unfortunately, it feels that way.

The facts are inconvenient: Nexperia doesn't supply "cutting-edge AI chips" like NVIDIA or other well-known manufacturers, but rather large quantities of so-called discrete semiconductors – fundamental components also for the automotive industry. Accordingly, the German industry association VDA warns of risks, including production downtime. Manufacturers are monitoring the situation and emphasizing short-term safeguards, but structural dependence remains a problem. Anyone who still relies on an exclusive source in the Far East is gambling with the production reliability of their own plants.

This dependence doesn't just affect chips. Printed circuit board supply chains are also global, multi-tiered, and therefore vulnerable. Every disruption – be it political, logistics, certification or compliance – has a direct impact on costs, deadlines and quality. Those who rely on a purely offshore setup and do not maintain a second source lose responsiveness and, above all, reliability. That is precisely why we as PRECOPLAT has always relied on “Made in Germany”: short routes, secure data, rapid response – and the ability to ramp up capacity in a planned manner.
Andreas BRÜGGEN, Executive Director Precoplat: "For us, Made in Germany means short routes, secure data, and rapid response – with the option of ramping up capacity in a planned manner when it matters."

“But local procurement is too expensive…?” – A calculation example

Let’s take a simple, illustrative calculation for a mid-class circuit board:
100% Asia: €8,00 each.
• 10% of the quantity as a second source for Precoplat: 12,00 € each.

Mixed unit price:
90% × €8,00 = €7,20
10% × €12,00 = €1,20
Sum = 8,40 €.

That's an additional €0,40 per unit, or 5% compared to pure offshore sourcing. For 1.000 units, that would be an additional €400 – in exchange for a reliable second source, shorter response times, and the option to immediately scale up to Germany in the event of disruptions. Precisely these 10% are enough for PRECOPLAT to keep qualification, data sets, and processes "warm" – and to ramp up the quantity without delay in an emergency.


Sustainability & Risk: A double argument for Europe
In addition to risk mitigation, there are ecological reasons for using European printed circuit boards: stricter environmental and labor standards, shorter transport routes, lower emissions, and traceable process chains. Some companies, such as Wurm GmbH & Co. KG Elektronische Systeme, have already recognized this and have publicly justified their decision to use European PCBs with sustainability, environmental protection, and water conservation—a path that is not only correct but also wise in these geopolitically tense times.Source)

We offer:
Transparency: Clarity about production status, batch sizes, and delivery dates – without time zone or language barriers.
Reliability: Stable, plannable supply chains instead of ad hoc firefighters.
Responsiveness and scalability: If part of your series is already running with us, we can expand capacity at short notice – with existing tool data, identical production documentation, and tested quality.

From our point of view, the message of the Nexperia crisis is clear: Secure your supply chains. Establish a second source in Europe/Germany—not "someday," but now. This way, you protect your production, mitigate geopolitical risks, and simultaneously contribute to local industrial value creation.

You can find out more about our “Made in Germany” approach on our website:

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Galvanic Nickel Gold (hard and bond gold)

Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).

OSP (Organic Surface Protection)

OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.

The shelf life is limited to 6 months.

Chemical silver (chem Ag.)

Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.

A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).

Chemical tin (chem. Sn)

Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.

The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.

This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.

Electroless Nickel Immersion Gold (ENIG)

ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.

The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.

The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.

hot air tinning (HAL = Hot Air Leveling)

The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.

The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.

HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.