Company holidays
Dear customers, we are taking a company holiday break. Our factory will be closed from December 20, 2025, through January 4, 2026. For urgent appointments before Christmas, please contact our sales team.
Our family business is run by the siblings Andreas Brüggen and Katharina Völker in the second generation and produces highly automated and in all series sizes – unequipped single-sided circuit boards, double-sided circuit boards, Multilayer up to 24 layers and semi-flexible circuit boardsOur story begins in the early 1970s in the basement of the Café Bristol in Krefeld: Inspired by the film “Saturday Night Fever”, restaurateur Manfred Völker wanted to jump on the bandwagon of modern discotheque equipment with an elaborate light and sound design. In order to save costs, he developed, together with some electronics students, printed circuits based on copper-coated pertinax plates. Tired of the catering trade, but still interested in printed circuit board technology Manfred Völker was very interested in the commercial prospects of Circuit board and founded in 1977 Precoplat precisionPCBs-Technik GmbH in Krefeld.
"With decades of commitment, I helped shape the foundation of the company as a founding member. My focus now is on preserving values and offering support as a consultant."
"With passion and over 20 years of experience in the printed circuit board industry, I run our company together with my sister with one goal: innovation and quality that create trust."
"I am proud to be part of our family business and to work together on modern solutions for our customers - my goal: to build a bridge between tradition and innovation."
We pride ourselves on offering our customers innovative technologies, the highest quality and an environmentally conscious approach.
Katharina Völker - Managing Director -
From 1983 onwards, the business grew steadily, so that a larger location was needed, which was acquired in 1986 with the 25.000 square metre production site of the former Krefeld-based ZSK Stickmaschinen GmbH (Zangs). In 1962, ZSK used its embroidery machines to produce the patches for NASA astronauts that are still well-known today at this location. This means that our production has been based in Krefeld since it was founded, the city known for velvet and silk in the immediate vicinity of the state capital Düsseldorf, and it is also a location with history.
Today, as in the past, the finest structures "Made in Germany" are manufactured precisely and reliably in the time-honored walls. In view of the increasing demand for increasingly complex electronic components with an increasing integration of more and more functions on chips and other electronic components, the requirements in terms of complexity and miniaturization of conductor tracks, pads and other structures on the circuit board are also growing. For this reason, all process steps in the manufacture of the circuit board are always kept up to date with the latest technology.
Through continuous investment in new equipment and technologies, we achieve consistent process stability, which enables us to ensure our high quality standards. In addition, communication with you and the resulting solid preparatory work is the most important point in converting your data into a perfect product. The high level of technology and automation in our production enables your data to be quickly converted into a product ready for delivery. We have optimized the complex and multi-layered production process of various chemical, photo-technical and mechanical work steps in circuit board production so that we achieve the right level of flexibility to efficiently respond to a wide variety of needs and requirements.
From the former “cellar child” developed Precoplat This has made us a highly modern medium-sized company with around 75 employees and an annual turnover of twelve million euros. Today, our production facilities produce up to 2.000 printed circuit boards every day for a wide variety of purposes.
Also known as hard gold plating. In contrast to the ENIG process, nickel is also used as a diffusion barrier to the copper, but the gold is deposited galvanically, i.e. with an external power source. This means that much thicker layers of 0,8 - 5 µ can be achieved. This "hard gold" is used for circuit boards with connector strips that are plugged in multiple times. The thicker the gold, the higher the number of plug-in cycles (example: 0,4 µ Au = 20 plug-in cycles, 2 µ = 500 plug-in cycles).
OSP is an organic solution that is selectively deposited on solderable copper surfaces with a layer thickness of 0,02 to 0,06 µ using an immersion or rinsing bath. The surface is flat and is well suited for fine SMD assembly. Multiple soldering processes are not possible because the transparent layer decomposes at temperatures above 150 °C.
The shelf life is limited to 6 months.
Chemical silver is a metallic, highly re-solderable surface with a layer thickness of 0,15 - 0,45 µ that is deposited on soldering points without external current (similar to the chemical tin process). The surface is flat and is well suited for SMD assembly.
A storage period of up to 6 months is possible. Similar to chemical tin, the surface loses its solderability due to fluctuations in ambient temperature and humidity. The surfaces must under no circumstances come into contact with materials containing sulphur (such as certain types of wrapping paper).
Chemical tin is a metallic, very easy to solder finish. A thin layer of approx. 0,8 - 1,2 µ tin is deposited without external current on the copper of the soldering points, where it prevents the copper from oxidizing. The surface of the pads is very flat and is therefore particularly suitable for SMD, CoB and HDI and press-fit technology.
The storage time should not exceed 6 months. Humidity and temperature differences during storage can affect the solderability.
Between the nickel and gold process steps in the ENIG process, in the ENEPIG process, additional palladium is added as an intermediate layer (0,05 – 0,25 µ thick) into the final surface without external current.
This additional layer is not only ideal for all soldering methods, but is primarily used for gold wire bonding. This process is considered a very expensive special application.
ENIG or chemical nickel gold is a metallic, very easy to solder finish. It is deposited on the copper layer of the soldering points with a layer thickness of 4 - 9 µ nickel and ideally 0,05 - 0,1 µ gold, which prevents the copper from oxidizing. The deposition takes place without external current using catalytic processes and the electrical potential difference (valence) of the metals used.
The surface is very flat, the multiple solderability is suitable for SMD, Cob and HDI technology as well as aluminum wire bonding and has a storage life of up to 12 months.
The surface is IPC-4552 specified and meets the current requirements of RoHs and WEE.
The term hot air tinning is used both for the production process and for the surface of printed circuit boards with 99,55% Sn (tin), 0,3% Ag (silver) and 0,15 -0,05% Ni (nickel). It is intended to protect the underlying copper of the soldering points from oxidation.
The circuit boards are immersed in a hot melt (> 260°C) made of the metals mentioned. The surfaces to be tinned are then blown flat with hot compressed air and the holes are blown free. The surface is very suitable for multiple soldering and can be stored for up to 12 months.
HAL is very attractive in terms of quality and price for radial assembly and single-sided SMD technology. Our solder is lead-free and complies with RoHS guidelines.