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—  Schematic Key for Multilayer and HDI-Technology Built-Ups — 

(PCP) - Precoplat Präzisions-Leiterplatten-Technik GmbH - Ihr Deutscher Leiterplattenhersteller



a b c d e f g+h+i j
04 188 FR4 55 L41.35_73.18 p10_20 v1.99_2-3_4-5_6-7_s0
columns and equal kind of positions are separated by "_". Equal prefixes in one column are reduced to one.
4_188_FR4_L41.35_73.18_p10_20_v1.99_2-3_4-5_6-7_s0


a numbers
of layers:
core-layer 04 4-layer of MLBs numeric
sequential
built-ups
(1-4-1) 2-outer-layer of sequential built-ups and 4-core-layer
b total thickness after the built up and final plating: 188 1880 µ per 10 µ
c type of material: FR4 quality of material  
d copper thickness of the outer layer after the built up and final plating: 55 55 my per 1µ
e different kinds of core material and copper foils on both sides: L41.35_
L73.18
L = core material (prefix)
p.e.: core thickness 410µ + cu foil 2 x 35µ + core thickness 730µ + cu foil 2 x 18µ
per 10 µ . per 1µ
f number and thickness of the prepregs: p10_ p 20 p = prepregs (prefix)
p.e.: core thickness 410µ +
core thickness 730µ
per 10 µ
g
+
h
+
I
Buried Vias: v2-3 v = buried via (prefix)
connects inner layer 2 to inner layer 3
inner layers
Blind Vias: v1.99 v = blind via (prefix)
connects outer layer 1 to inner layer 2/3/4 etc and outer layer 99 to inner7/8 etc
outer layers:
top outer is layer 01 and bottom outer is always layer 99 (p.e.: 4-layer ML has therefor layer 1+2+3+99)
special code number of the assembly: s0 none mit Sondermontage Anleitung
J Standard-Multilayer standard built-up in our factory
| Precoplat Präzisions-Leiterplatten-Technik GmbH mit Sitz in 47877 Willich |
| Registergericht: Amtsgericht Krefeld | Reg.-Nr.: HRB 1444 | USt-IdNr.: DE 120 156 920 |
| Geschäftsführung: Hildegard Völker & Andreas Brüggen | 47805 Krefeld, Oberdiessemer Str. 15 |
| Telefon: ++49 (0) 21 51 825 1 | Telefax: ++49 (0) 21 51 932 450 | eMail: infotern@precoplat.de  |


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